dvLED panels, grouped by the technology on their surface

COBChip on board

The bare LED dies are mounted straight onto the board and sealed under a single smooth resin surface.

Nothing stands proud of the face, so there is nothing to knock off. The surface takes impact, sheds heat well and reaches the deepest black of any panel we build, which is why it holds a picture together in a dark studio.

The trade off: dies mounted this way cannot be measured and sorted the way finished packages can, so raw uniformity starts lower and calibration carries far more of the load. That is precisely where our own Color Space Engine earns its keep. And because a single sub pixel cannot be lifted out, service happens at module level rather than pixel level.

Best for: The finest pitches, any room where contrast decides the shot, and floors when a load bearing cover sits over the modules.

MIP & SMD FCMicro LED in package, and flip chip surface mount

Two routes to fine pitch that keep the advantage of a finished, measurable package.

Micro LED in package puts very small dies into their own tiny packages before they are placed on the board. Because every package can still be measured and sorted before mounting, uniformity and colour consistency start high and stay there from batch to batch. This is the main reason design studios choose MIP: the separate micro LED crystals can be binned and sorted far more finely before calibration, so homogeneity and colour accuracy are superior to COB by default. The small dies and the larger black area between them also mean minimal light reflection and high contrast.

Flip chip surface mount turns the die over and bonds it directly, with no wire crossing the top of the emitter. Less material above the light means more of it reaches the room for the same power, heat behaves better, and the package copes with pitches that would trouble a conventional build.

Best for: Colour critical rooms that also need serviceability, and long lived installations where batch to batch consistency matters.

IMDIntegrated matrix device

Several pixels, usually four, gathered into one package.

This sits between surface mount and chip on board and takes something from each: fine pitch behaviour with straightforward manufacture and service, in a robust cabinet built to be rigged, struck and rigged again.

It is the family we reach for when a camera is in the room. High refresh and high frame rate keep the dvLED wall clean on sensor, with no banding rolling through the shot.

Best for: Virtual production and broadcast, rental and touring, and curved or cornered builds.

SMDSurface mount device

Individual red, green and blue LEDs placed onto the board. The most mature way to build a dvLED wall.

Proven, serviceable down to a single package, and the reason a large format screen can be affordable at all. This is also the chapter that goes outside and stays legible in direct sun, and the one that carries the flexible cabinets for curves and cylinders.

The trade off: at very fine pitches those small exposed packages become delicate, which is why the finest work belongs to chip on board and micro LED in package instead. Where a dvLED wall gets touched, dusty or rained on, a GOB protective coating can be specified on top.

Best for: Outdoor and daylight, large formats, curved and flexible builds, and projects where value per square metre leads.

Control SystemERMAC processing, scaling and distribution

The half of the display that is not the panel, and the reason the colour holds.

Every TRUE dvLED wall is driven by ERMAC, our own control system, developed and produced in Europe. The SPU-32 does the processing, the LSC-108 handles scaling and distribution, receiving cards sit behind the panels, and input and output cards decide what arrives and how it travels.

Because the panel and the control system are engineered by one team, calibration is not a layer bolted on at the end. It is held in hardware, across brightness levels and across production batches.